Iwill KA266-R Ver 1.3: Difference between revisions
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===Problems Encountered=== | ===Problems Encountered=== | ||
Aluminum electrolytics around the PCI slots are starting to bulge from age and all electrolytics on this board are the same brand and will probably do the same. | Aluminum electrolytics around the PCI slots are starting to bulge from age and all electrolytics on this board are the same brand and will probably do the same. | ||
====Causes==== | ====Causes==== | ||
*Age | *Age | ||
| Line 23: | Line 22: | ||
*Replace all electrolytic caps | *Replace all electrolytic caps | ||
==Disassembly Notes== | ==Disassembly Notes== | ||
* Handle PCB by edges to avoid stressing BGA devices or touching static sensitive devices | * Handle PCB by edges to avoid stressing BGA devices or touching static sensitive devices | ||
* Use ESD safe equipment | * Use ESD safe equipment | ||
* This PCB is a high density multi-layer PCB with a high thermal mass, some soldering irons may struggle | * This PCB is a high density multi-layer PCB with a high thermal mass, some soldering irons may struggle | ||
==Original Parts== | ==Original Parts== | ||
===Iwill KA266-R Ver 1.3=== | ===Iwill KA266-R Ver 1.3=== | ||
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|HT | |HT | ||
|- | |- | ||
|TC1,2,3,22,27,28,33,34,39,40,42,45,46, | |TC1,2,3,22,27,28,33,34,39,40,42,45,46,50,51,52,53,#? | ||
50,51,52,53,#? | |||
|18 | |18 | ||
|22µF | |22µF | ||
Revision as of 01:43, 30 May 2023
- For more information, see this article's corresponding Wikipedia page: Device.
Iwill KA266-R Ver. 1.3
| Preliminary Information | |
|---|---|
| Release Year | 2001 |
| Leak Risk | Medium |
| Batteries | CR2032 Coin |
| Mounting Technology | Through Hole, SMD, BGA, Sockets |
| Capacitor Types | Wet Electrolytic, Tantalum, MLCC |
| Destructive Entry | No |
This page is for the Iwill KA266-R AMD motherboard version 1.3. This Board was made in 2001 and has hardware IDE raid with 3 DDR 266/200 slots, 4 IDE channels, 5 PCI slots, 4.1 channel integrated sound (C3DX HSP56), and an AGP slot.
Known Issues
Problems Encountered
Aluminum electrolytics around the PCI slots are starting to bulge from age and all electrolytics on this board are the same brand and will probably do the same.
Causes
- Age
- Cap Chemistry
- Heat around PCI card area & CPU
Solutions
- Replace all electrolytic caps
Disassembly Notes
- Handle PCB by edges to avoid stressing BGA devices or touching static sensitive devices
- Use ESD safe equipment
- This PCB is a high density multi-layer PCB with a high thermal mass, some soldering irons may struggle
Original Parts
Iwill KA266-R Ver 1.3
| RefDes | Qty | Capacitance | Voltage | Mount | Diameter/Size | Height | Lead Spacing | Temp | Type | Brand | Series |
|---|---|---|---|---|---|---|---|---|---|---|---|
| TC5,9,10,11,12,13,14,15,16,17,20,21,38 | 13 | 1500µF | 6.3v | Through Hole | 10mm | 15mm | 5mm | 105°C | Wet Electrolytic | HERMEI | LE |
| TC23,24,25,#? | 4 | 1500µF | 10v | Through Hole | 10mm | 20.3mm | 5mm | 105°C | Wet Electrolytic | HERMEI | LE |
| TC6,7,29,31,37,41,43,44,47,48,49 | 11 | 1000µF | 6.3v | Through Hole | 8mm | 11.8mm | 3.5mm | 105°C | Wet Electrolytic | HERMEI | LE |
| TC32,35,36 | 3 | 470µF | 16v | Through Hole | 8mm | 14mm | 3.5mm | 105°C | Wet Electrolytic | HERMEI | LE |
| TC4,18,19,54 | 4 | 220µF | 16v | Through Hole | 6.5mm | 12mm | 2.5mm | 105°C | Wet Electrolytic | HERMEI | HT |
| TC1,2,3,22,27,28,33,34,39,40,42,45,46,50,51,52,53,#? | 18 | 22µF | 16v | Through Hole | 5mm | 5.5mm | 2mm | 105°C | Wet Electrolytic | HERMEI | SH |
Replacement Parts
Basic PCB Name
| RefDes | Qty | Compatible Part Number | Order Links |
|---|---|---|---|
| Digikey |
If parts are not available or different selection is preferred, you can use the values in the Original Parts section to perform a parametric search.
Kits
- Digikey BOM: https://www.digikey.com/