Iwill KA266-R Ver 1.3: Difference between revisions

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(Forgot 1 cap. All caps are now accounted for.)
Line 4: Line 4:
|Release Year = 2001
|Release Year = 2001
|Mounting Technology = Through Hole, SMD, BGA, Sockets
|Mounting Technology = Through Hole, SMD, BGA, Sockets
|Capacitor Types = Wet Electrolytic, Tantalum, MLCC
|Capacitor Types = Wet Electrolytic, Polymer, Tantalum, MLCC
|Leak Risk = Medium
|Leak Risk = Medium
|Batteries = CR2032 Coin RTC
|Batteries = CR2032 Coin RTC
Line 117: Line 117:
|HERMEI
|HERMEI
|SH
|SH
|-
|TC8
|1
|820µF
|4v
|Through Hole
|10mm
|12.5mm
|5mm
|105°C
|Polymer
|Fujitsu
|(null)
|}
|}
==Replacement Parts==
==Replacement Parts==
Line 156: Line 169:
|EEA-GA1C220
|EEA-GA1C220
|[https://www.digikey.com/en/products/detail/panasonic-electronic-components/EEA-GA1C220/2504573 Digikey]
|[https://www.digikey.com/en/products/detail/panasonic-electronic-components/EEA-GA1C220/2504573 Digikey]
|-
|TC8
|1
|RR50G821MDN1
|[https://www.digikey.com/en/products/detail/nichicon/RR50G821MDN1/2207228 Digikey]
|}
|}
===Kits===
===Kits===

Revision as of 02:51, 30 May 2023

Iwill KA266-R Ver. 1.3
File:Iwill KA266R Ver13.jpeg
Preliminary Information
Release Year 2001
Leak Risk Medium
Batteries CR2032 Coin RTC
Mounting Technology Through Hole, SMD, BGA, Sockets
Capacitor Types Wet Electrolytic, Polymer, Tantalum, MLCC
Destructive Entry No

This page is for the Iwill KA266-R AMD motherboard version 1.3. This Board was made in 2001 and has hardware IDE raid with 3 DDR 266/200 slots, 4 IDE channels, 5 PCI slots, 4.1 channel integrated sound (C3DX HSP56), and an AGP slot.

Known Issues

Problems Encountered

Aluminum electrolytics around the PCI slots are starting to bulge from age and all electrolytics on this board are the same brand and will probably do the same.

Causes

  • Age
  • Cap Chemistry
  • Heat around PCI card area & CPU

Solutions

  • Replace all electrolytic caps

Disassembly Notes

  • Handle PCB by edges to avoid stressing BGA devices or touching static sensitive devices
  • Use ESD safe equipment
  • This PCB is a high density multi-layer PCB with a high thermal mass, some soldering irons may struggle

Original Parts

Iwill KA266-R Ver 1.3

Capacitor Specifications and Footprint Information
RefDes Qty Capacitance Voltage Mount Diameter/Size Height Lead Spacing Temp Type Brand Series
TC5,9,10,11,12,13,14,15,16,17,20,21,38 13 1500µF 6.3v Through Hole 10mm 15mm 5mm 105°C Wet Electrolytic HERMEI LE
TC23,24,25,#? 4 1500µF 10v Through Hole 10mm 20.3mm 5mm 105°C Wet Electrolytic HERMEI LE
TC6,7,29,31,37,41,43,44,47,48,49 11 1000µF 6.3v Through Hole 8mm 11.8mm 3.5mm 105°C Wet Electrolytic HERMEI LE
TC32,35,36 3 470µF 16v Through Hole 8mm 14mm 3.5mm 105°C Wet Electrolytic HERMEI LE
TC4,18,19,54 4 220µF 16v Through Hole 6.5mm 12mm 2.5mm 105°C Wet Electrolytic HERMEI HT
TC1,2,3,22,27,28,33,34,39,40,42,45,46,50,51,52,53,#? 18 22µF 16v Through Hole 5mm 5.5mm 2mm 105°C Wet Electrolytic HERMEI SH
TC8 1 820µF 4v Through Hole 10mm 12.5mm 5mm 105°C Polymer Fujitsu (null)

Replacement Parts

Iwill KA266-R Ver 1.3

Capacitors
RefDes Qty Compatible Part Number Order Links
TC5,9,10,11,12,13,14,15,16,17,20,21,38 13 EEU-FS0J152B Digikey
TC23,24,25,#? 4 EEU-FR1A152B Digikey
TC6,7,29,31,37,41,43,44,47,48,49 11 ECA-0JHG102 Digikey
TC32,35,36 3 EEU-FR1C471 Digikey
TC4,18,19,54 4 ECA-1CHG221 Digikey
TC1,2,3,22,27,28,33,34,39,40,42,45,46,50,51,52,53,#? 18 EEA-GA1C220 Digikey
TC8 1 RR50G821MDN1 Digikey

Kits

Related Links

References

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