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Here you can find an explanation of some terms that may be used on this site
Here you can find an explanation of some terms that may be used on this site
 
== B ==
=== Cap(s) ===
;BGA
Stands for "Ball Grid Array" which is a mounting technology for [[Part Footprints]]
;BOM
Stands for "Bill of Materials" which is a list of parts for a device or PCB
== C ==
;Cap(s)
Short for "[[Capacitors|Capacitor]]"
Short for "[[Capacitors|Capacitor]]"
 
;Capacitor Bung
=== Condenser ===
The rubber seal at the bottom (Radial) or negative side (Axial) of an Aluminum Electrolytic or Aluminum Polymer capacitor
;Condenser
Condenser (or condensator) is the original term used to describe what is now referred to as a "[[Capacitors|Capacitor]]" but became obsolete as it is easily confused with condensers (heat exchangers). This term is used most in older documentation but still remains for certain applications like "condenser microphone" or in documentation that has been translated to English from a language that still uses the original term.
Condenser (or condensator) is the original term used to describe what is now referred to as a "[[Capacitors|Capacitor]]" but became obsolete as it is easily confused with condensers (heat exchangers). This term is used most in older documentation but still remains for certain applications like "condenser microphone" or in documentation that has been translated to English from a language that still uses the original term.
 
;[[CRT]]
=== PCB ===
Stands for "Cathode Ray Tube", a glass display tube used in older electronics
== D ==
;DIP
Stands for "Dual Inline Package" which is a mounting technology for [[Part Footprints]]
== H ==
;Hz or Cycles
Hertz is a measurement of frequency and is stated as the amount of times something happens within one second. Older devices and documents may also use the term "cycles" in the same way.
== I ==
;IC or Chip
Stands for "Integrated Circuit" which is a semiconductor device that combines the functionality of multiple other parts into one to perform more complicated tasks.
== P ==
;PCB
Stands for "Printed Circuit Board' which is the board that parts are typically mounted to in devices, sometimes called a PWB (Printed Wiring Board) in older devices.
Stands for "Printed Circuit Board' which is the board that parts are typically mounted to in devices, sometimes called a PWB (Printed Wiring Board) in older devices.
 
== R ==
=== RefDes ===
;RefDes
[[File:Brother DCP-115C - power unit-4811.jpg|thumb|A circuit board assembly from the PSU of a Brother printer with clearly marked Reference Designations. Some components are not populated.]]
Short for "Reference Designation" which is an identification used to mark the location of each part on a PCB. These are also used for schematics and BOMs to reference which parts should be put at a location on the PCB.
Short for "Reference Designation" which is an identification used to mark the location of each part on a PCB. These are also used for schematics and BOMs to reference which parts should be put at a location on the PCB.


RefDes' are usually denoted with a letter and a number. The letters describe the kind of part that goes there. Some common examples:
RefDes' are usually denoted with a letter and a number. The letters describe the kind of part that goes there. Some common examples:
 
* BD - Bridge Rectifier
* C - Capacitor
*C - Capacitor
* R - Resistor
*CN - Connector
*D - Diode
*F - Fuse
*FR or RF - Fusible Resistor
* L - Inductor
* L - Inductor
* Q - A transistor or MOSFET
* Q - A transistor or MOSFET
* U - ICs like processors, RAM, or ROMs
* R - Resistor
*S or SW - Switch (button / slide switch / rotary switch)
* T - Transformer
* U or IC - ICs like processors, RAM, or ROMs
== S ==
;SIP
Stands for "Single Inline Package" which is a mounting technology for [[Part Footprints]]
;SMD or SMT
Stands for "Surface Mount Device" or "Surface Mount Technology" which is a mounting technology for [[Part Footprints]]


=== CRT ===
'''SOT'''
Stands for "Cathode Ray Tube", a glass display tube used in older electronics


=== BOM ===
Stands for Small Outline Transistor, a family of transistors with small package sizes. All SOT devices are surface mount.
Stands for "Bill of Materials" which is a list of parts for a device or PCB
== T ==
;THT
Stands for "Through Hole Technology" which is a mounting technology for [[Part Footprints]]


=== IC or Chip ===
'''TO'''
Stands for "Integrated Circuit" which is a semiconductor device that combines the functionality of multiple other parts into one to perform more complicated tasks.


=== SMD or SMT ===
Stands for "Transistor Outline". A type of through-hole transistor packages.
Stands for "Surface Mount Device" or "Surface Mount Technology" which is a mounting technology for [[Part Footprints]]


=== THT ===
'''TSOT'''
Stands for  "Through Hole Technology" which is a mounting technology for [[Part Footprints]]


=== SIP ===
Stands for Thin Small Outline Transistor. Lower-height versions of SOT components.
Stands for "Single Inline Package" which is a mounting technology for [[Part Footprints]]
== Q ==
 
;QFP
=== DIP ===
Stands for "Dual Inline Package" which is a mounting technology for [[Part Footprints]]
 
=== BGA ===
Stands for "Ball Grid Array" which is a mounting technology for [[Part Footprints]]
 
=== QFP ===
Stands for "Quad Flat Package" which is a mounting technology for [[Part Footprints]]
Stands for "Quad Flat Package" which is a mounting technology for [[Part Footprints]]
=== Hz or Cycles ===
Hertz is a measurement of frequency and is stated as the amount of times something happens within one second. Older devices and documents may also use the term "cycles" in the same way.
[[Category:Information]]
[[Category:Information]]

Latest revision as of 15:24, 13 June 2023

Here you can find an explanation of some terms that may be used on this site

B

BGA

Stands for "Ball Grid Array" which is a mounting technology for Part Footprints

BOM

Stands for "Bill of Materials" which is a list of parts for a device or PCB

C

Cap(s)

Short for "Capacitor"

Capacitor Bung

The rubber seal at the bottom (Radial) or negative side (Axial) of an Aluminum Electrolytic or Aluminum Polymer capacitor

Condenser

Condenser (or condensator) is the original term used to describe what is now referred to as a "Capacitor" but became obsolete as it is easily confused with condensers (heat exchangers). This term is used most in older documentation but still remains for certain applications like "condenser microphone" or in documentation that has been translated to English from a language that still uses the original term.

CRT

Stands for "Cathode Ray Tube", a glass display tube used in older electronics

D

DIP

Stands for "Dual Inline Package" which is a mounting technology for Part Footprints

H

Hz or Cycles

Hertz is a measurement of frequency and is stated as the amount of times something happens within one second. Older devices and documents may also use the term "cycles" in the same way.

I

IC or Chip

Stands for "Integrated Circuit" which is a semiconductor device that combines the functionality of multiple other parts into one to perform more complicated tasks.

P

PCB

Stands for "Printed Circuit Board' which is the board that parts are typically mounted to in devices, sometimes called a PWB (Printed Wiring Board) in older devices.

R

RefDes
A circuit board assembly from the PSU of a Brother printer with clearly marked Reference Designations. Some components are not populated.

Short for "Reference Designation" which is an identification used to mark the location of each part on a PCB. These are also used for schematics and BOMs to reference which parts should be put at a location on the PCB.

RefDes' are usually denoted with a letter and a number. The letters describe the kind of part that goes there. Some common examples:

  • BD - Bridge Rectifier
  • C - Capacitor
  • CN - Connector
  • D - Diode
  • F - Fuse
  • FR or RF - Fusible Resistor
  • L - Inductor
  • Q - A transistor or MOSFET
  • R - Resistor
  • S or SW - Switch (button / slide switch / rotary switch)
  • T - Transformer
  • U or IC - ICs like processors, RAM, or ROMs

S

SIP

Stands for "Single Inline Package" which is a mounting technology for Part Footprints

SMD or SMT

Stands for "Surface Mount Device" or "Surface Mount Technology" which is a mounting technology for Part Footprints

SOT

Stands for Small Outline Transistor, a family of transistors with small package sizes. All SOT devices are surface mount.

T

THT

Stands for "Through Hole Technology" which is a mounting technology for Part Footprints

TO

Stands for "Transistor Outline". A type of through-hole transistor packages.

TSOT

Stands for Thin Small Outline Transistor. Lower-height versions of SOT components.

Q

QFP

Stands for "Quad Flat Package" which is a mounting technology for Part Footprints

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