MSI K8N SLI: Difference between revisions
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(Created page with "{{WikipediaInfoAlt|Device}} {{DeviceAlerts}} {{InfoboxDevice |Title = MSI K8N SLI |Picture = |Release Year = 2004 |Mounting Technology = Through Hole, SMD, BGA, Sockets |Capacitor Types = Aluminum Electrolytic |Leak Risk = Medium |Batteries = Yes (Removable RTC CR2032) |Destructive Entry = No }} This is a template page for creating new pages for devices, troubleshooting them, part lists, and other repair info. == Known Issues == ===Symptom or Problem Encountered=== ==...") |
(→Basic PCB Name: Added original caps) |
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This is a template page for creating new pages for devices, troubleshooting them, part lists, and other repair info. | This is a template page for creating new pages for devices, troubleshooting them, part lists, and other repair info. | ||
== Known Issues == | == Known Issues == | ||
===Symptom or Problem Encountered=== | ===Symptom or Problem Encountered=== | ||
====Causes==== | ====Causes==== | ||
Line 20: | Line 18: | ||
====Solutions==== | ====Solutions==== | ||
*Solution to the problem | *Solution to the problem | ||
== Disassembly Notes == | == Disassembly Notes == | ||
*Handle PCB by edges to avoid stressing BGA devices or touching static sensitive devices | *Handle PCB by edges to avoid stressing BGA devices or touching static sensitive devices | ||
Line 26: | Line 23: | ||
*This PCB is a high density multi-layer PCB with a high thermal mass, some soldering irons may struggle | *This PCB is a high density multi-layer PCB with a high thermal mass, some soldering irons may struggle | ||
== Original Parts == | == Original Parts == | ||
=== | === MS-7175 Ver 2.0 === | ||
{| class="wikitable sortable" | {| class="wikitable sortable" | ||
|+Capacitor [[Capacitor Specifications|Specifications]] and | |+Capacitor [[Capacitor Specifications|Specifications]] and [[Part Footprints|Footprint]] Information | ||
!RefDes | !RefDes | ||
!Qty | !Qty | ||
Line 43: | Line 39: | ||
!Series | !Series | ||
|- | |- | ||
|EC45, EC46, EC47, EC48, EC49, EC52 | |||
|6 | |||
|100 µF | |||
|16V | |||
|Through Hole | |||
| | | | ||
| | | | ||
| | | | ||
|105 °C | |||
| | | | ||
| | |||
| | |||
|- | |||
|EC35, EC55, EC67, EC71 | |||
|4 | |||
|100 µF | |||
|25V | |||
|Through Hole | |||
| | |||
| | |||
| | |||
|105 °C | |||
| | |||
| | |||
| | |||
|- | |||
|EC31, EC38, EC4, EC61, EC62, EC63, EC64, EC68, EC69, EC70 | |||
|9 | |||
|1000 µF | |||
|6.3V | |||
|Through Hole | |||
| | |||
| | |||
| | |||
|105 °C | |||
| | |||
| | |||
| | |||
|- | |||
|EC6, EC12, EC18, EC23 | |||
|4 | |||
|1500 µF | |||
|16V | |||
|Through Hole | |||
| | |||
| | |||
| | |||
| | |||
| | |||
| | |||
| | |||
|- | |||
|EC26 | |||
|1 | |||
|1800 µF | |||
|6.3V | |||
|Through Hole | |||
| | |||
| | |||
| | |||
| | |||
| | |||
| | |||
| | |||
|- | |||
|EC17, EC21, EC22, EC25, EC29 | |||
|5 | |||
|3300 µF | |||
|6.3V | |||
|Through Hole | |||
| | |||
| | |||
| | |||
| | |||
| | |||
| | |||
| | |||
|- | |||
|EC2, EC13, EC19, EC27, EC50, EC51, EC72, EC73, EC74 | |||
|9 | |||
|470 µF | |||
|10V | |||
|Through Hole | |||
| | |||
| | |||
| | |||
|105 °C | |||
| | |||
| | |||
| | |||
|- | |||
|EC58, EC75 | |||
|2 | |||
|470 µF | |||
|16V | |||
|Through Hole | |||
| | |||
| | |||
| | |||
|105 °C | |||
| | |||
| | |||
| | |||
|- | |||
|EC3, EC5 | |||
|2 | |||
|470 µF | |||
|6.3V | |||
|Through Hole | |||
| | |||
| | |||
| | |||
|105 °C | |||
| | |||
| | |||
| | |||
|- | |||
|EC59, EC60 | |||
|2 | |||
|680 µF | |||
|10V | |||
|Through Hole | |||
| | | | ||
| | | | ||
| | | | ||
| | |105 °C | ||
| | | | ||
| | | | ||
| | | | ||
|} | |} | ||
==Replacement Parts== | ==Replacement Parts== | ||
===Basic PCB Name=== | ===Basic PCB Name=== | ||
Line 72: | Line 184: | ||
|} | |} | ||
''If parts are not available or different selection is preferred, you can use the values in the [[#Original_Parts|Original Parts]] section to perform a parametric search.'' | ''If parts are not available or different selection is preferred, you can use the values in the [[#Original_Parts|Original Parts]] section to perform a parametric search.'' | ||
===Kits=== | ===Kits=== | ||
* Digikey BOM: https://www.digikey.com/ | * Digikey BOM: https://www.digikey.com/ | ||
== Related Links == | == Related Links == | ||
* [https://www.youtube.com Videos or other things that might be helpful to check out] | * [https://www.youtube.com Videos or other things that might be helpful to check out] | ||
== References == | == References == | ||
<references /> | <references /> | ||
[[Category:WorkNeeded:General]] | [[Category:WorkNeeded:General]] | ||
[[Category:WorkNeeded:OriginalParts]] | [[Category:WorkNeeded:OriginalParts]] | ||
[[Category:WorkNeeded:ReplacementParts]] | [[Category:WorkNeeded:ReplacementParts]] |
Revision as of 22:33, 21 January 2023
- For more information, see this article's corresponding Wikipedia page: Device.
This device is in the WorkNeeded:OriginalParts category because it was flagged as missing information on the original parts. It may have replacement parts listed but those cannot be assumed to be identical to the originals. If you have a list of the original parts, please feel free to add them by copying the relevant table from EditorsToolbox:Tables |
This device is in the WorkNeeded:General category because it was flagged as missing general information about the device. The information may be incomplete, using default text, or inaccurate and should be verified with external sources if possible. If you can add or correct information on this page, please feel free to edit it and do so. |
MSI K8N SLI
Preliminary Information | |
---|---|
Release Year | 2004 |
Leak Risk | Medium |
Batteries | Yes (Removable RTC CR2032) |
Mounting Technology | Through Hole, SMD, BGA, Sockets |
Capacitor Types | Aluminum Electrolytic |
Destructive Entry | No |
This is a template page for creating new pages for devices, troubleshooting them, part lists, and other repair info.
Known Issues
Symptom or Problem Encountered
Causes
- Description of cause
Solutions
- Solution to the problem
Disassembly Notes
- Handle PCB by edges to avoid stressing BGA devices or touching static sensitive devices
- Use ESD safe equipment
- This PCB is a high density multi-layer PCB with a high thermal mass, some soldering irons may struggle
Original Parts
MS-7175 Ver 2.0
RefDes | Qty | Capacitance | Voltage | Mount | Diameter/Size | Height | Lead Spacing | Temp | Type | Brand | Series |
---|---|---|---|---|---|---|---|---|---|---|---|
EC45, EC46, EC47, EC48, EC49, EC52 | 6 | 100 µF | 16V | Through Hole | 105 °C | ||||||
EC35, EC55, EC67, EC71 | 4 | 100 µF | 25V | Through Hole | 105 °C | ||||||
EC31, EC38, EC4, EC61, EC62, EC63, EC64, EC68, EC69, EC70 | 9 | 1000 µF | 6.3V | Through Hole | 105 °C | ||||||
EC6, EC12, EC18, EC23 | 4 | 1500 µF | 16V | Through Hole | |||||||
EC26 | 1 | 1800 µF | 6.3V | Through Hole | |||||||
EC17, EC21, EC22, EC25, EC29 | 5 | 3300 µF | 6.3V | Through Hole | |||||||
EC2, EC13, EC19, EC27, EC50, EC51, EC72, EC73, EC74 | 9 | 470 µF | 10V | Through Hole | 105 °C | ||||||
EC58, EC75 | 2 | 470 µF | 16V | Through Hole | 105 °C | ||||||
EC3, EC5 | 2 | 470 µF | 6.3V | Through Hole | 105 °C | ||||||
EC59, EC60 | 2 | 680 µF | 10V | Through Hole | 105 °C |
Replacement Parts
Basic PCB Name
RefDes | Qty | Compatible Part Number | Order Links |
---|---|---|---|
Digikey |
If parts are not available or different selection is preferred, you can use the values in the Original Parts section to perform a parametric search.
Kits
- Digikey BOM: https://www.digikey.com/